Innovations for more efficient packaging processes
Fraunhofer IVV Dresden will be presenting sealing tools with innovative thin layer temperature sensors at the FachPack fair in Nuremberg from 25 - 27 September 2018 (Hall 4, Stand 225). These sealing tools allow the inline monitoring of packaging processes. Non-sealed packaging can be drastically reduced or avoided completely using this new technology. Also being presented are self-learning assistance systems for machine operators that significantly increase the efficiency of packaging plants. Einen wesentlichen Beitrag zur Steigerung der Effizienz von Verpackungsanlagen leisten selbstlernende Bediener-Assistenzsysteme.
Stable and effective – sealing processes using thin layer temperature sensors
Fraunhofer IVV Dresden develops methods and technologies for the adaptive sealing and welding of polymeric packaging materials. The sealing tools with thin layer temperature sensors were developed in collaboration with the Fraunhofer Institute for Mechanics of Materials IWM. During packaging processes this means that faults such as folds or contamination in the sealing seam can be rapidly and effectively identified, faulty products can be removed, and process parameters adjusted where necessary. The new technology allows inline quality control for heat sealing and improves the process stability and product safety for packaged foods, pharmaceuticals, medical products, and technical goods.
Self-learning assistance systems for machine operators increase plant efficiency
The self-learning assistance system SAM helps operators run packaging plants. The system learns from the knowledge of qualified plant operators and then, in the event of a plant fault, automatically makes available proven strategies to remedy that fault. Faults can thus be rectified faster and permanently. Acting as sort of navigation system, the SAM enables operators to themselves recognize errors and their causes and to propose remedies.
Presentations in the TechBox forum on 26 September 2018
Under the motto "New technologies for more efficient packaging processes" the Fraunhofer IVV Dresden will give a presentation on the use of thin layer sensors in sealing tools for quality control in heat sealing and on the use of self-learning assistance systems for machine operators. This will be held from 14:00 - 16:00 on 26 September 2018 in Hall 4 in the TechBox forum. Fair visitors will also have the opportunity to learn about innovative developments of the partners of the Fraunhofer IVV Dresden: Maximum flexibility and quality for sealing and thermoforming via digital heating as well as more productive machinery via near-optimal robot motion on a programmable logic controller (PLC) and Forming Collar 4.0.