Our advanced S-ALD plant (Spatial Atomic Layer Deposition plant) enables flexible substrates to be coated with high-quality layers in a roll-to-roll process. The layers are deposited on the substrate surface by physical-chemical processes in so-called cycles. Each cycle deposits just an atomic or molecular layer, leading to excellent layer quality. The layer thickness can be set extremely accurately by the number of cycles. In contrast to other methods, the ALD process also enables 3-D surface structures to be uniformly covered with contour accuracy at the nanometer level. Some materials can be deposited at only ca. 60°C, enabling the coating of temperature-sensitive substrates. As the process operates at atmospheric pressure, integration into roll-to-roll production lines is relatively easy. Functional films can thus be produced which are also suitable for the encapsulation of organic electronics.