Press Releases

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  • Circular FoodPack - circular use of plastic packaging
    © IDF Kreativagentur - Jürgen Lindl

    CIRCULAR FoodPack aims to facilitate the circular use of plastic packaging addressing the most sensitive product category: Food. The CIRCULAR FoodPack project started in June 2021 and will run until November 2024 with about 5.4 million Euros of EU funding from Horizon 2020 the European Framework Programme for Research and Innovation. The project will be implemented by fourteen companies and research institutes from six European countries and is coordinated by the Fraunhofer Institute for Process Engineering and Packaging IVV in Freising.

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  • Climate neutral recycling process "Waste4Future"
    © Fraunhofer IMWS

    A sustainable society with climate-neutral processes requires significant adjustments in the value chains, which are only possible through innovations. Seven Fraunhofer Institutes are pooling their expertise in the lighthouse project "Waste4Future" to develop new solutions for this goal, from the raw material base to material flows and process engineering right to the end of a product's life cycle. In particular, they want to increase energy and resource efficiency in the use of plastics and thus pave the way for a chemical industry that requires fewer fossil raw materials and produces fewer emissions.

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  • Reducing plastic waste / 2021

    Bioactive paper coatings to replace plastic for packaging foods

    Research News / May 03, 2021

    A sealed paper bag with the coating on the inside.
    © Fraunhofer

    Research News / May 03, 2021 The amount of plastic waste increases every year. Some of this waste is due to plastic packaging used to protect food. As part of the “BioActiveMaterials” project, researchers at the Fraunhofer-Gesellschaft have developed an eco-friendly coating for paper packaging. With this, not only is plastic saved, but the coating of plant-based proteins and waxes also extends the shelf life of the food. After use, the packaging can be placed in the waste paper recycling bin for disposal.

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  • How Do We Want to Run Our Economy and Production?

    Press release / December 21, 2020

    Hydroponischer Anbau von Salatpflanzen
    © Fraunhofer EMB

    In the EVOBIO project, 19 Fraunhofer Institutes have combined their expertise and over a period of five months have developed concepts and modules for a new way of doing business. This is now demonstrated through the use of selected examples.

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  • Let’s rethink plastic!

    Press release / October 13, 2020

    Packaged herbs and edible flowers in front of packaging machine
    © Fraunhofer FEP

    On April 1st the - FlexFunction2Sustain - Open Innovation Test Bed was launched to boost innovations for sustainable plastic and paper products to reach the market faster. The project, financed by the European Union’s Horizon 2020 research and innovation programme, will support the Plastics and Paper Processing Industry in overcoming environmental challenges while entering the digital age.

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  • Change of Directorship at Fraunhofer IVV

    Press release / April 02, 2020

    Portraits of Prof. Dr. Langowski and Prof. Dr. Büttner side by side
    © Fraunhofer IVV

    As of 1 April 2020, Prof. Andrea Büttner is the new Executive Director of the Fraunhofer Institute for Process Engineering and Packaging IVV in Freising.

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  • Granulate bottles with samples
    © Fraunhofer IVV

    Plastic recyclates produced from waste packaging have to meet high sensory requirements in order to be used for new products. Plastic recyclates often have off-odors, some of which have not hitherto been identified. The Fraunhofer Institute for Process Engineering and Packaging IVV has analyzed the sensory properties of post-consumer shopping bags made of low density polyethylene (LDPE) and originating from different collection systems.

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  • Printed 3D electronic component
    © Fraunhofer IVV

    The Fraunhofer Institute for Process Engineering and Packaging IVV will present the manufacture of 3D electronics using the roll-to-roll principle at the LOPEC international fair for printed electronics being held in Munich on 25-26 March 2020 (Hall B0, Stand 411). A new thermoforming process makes this possible. It allows higher degrees of forming via temperature profiling. It was developed at Fraunhofer IVV Dresden.

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