Fraunhofer Institute for Process Engineering and Packaging IVV3D electronics: Fraunhofer IVV developing roll to roll components
The Fraunhofer Institute for Process Engineering and Packaging IVV will present the manufacture of 3D electronics using the roll-to-roll principle at the LOPEC international fair for printed electronics being held in Munich on 25-26 March 2020 (Hall B0, Stand 411). A new thermoforming process makes this possible. It allows higher degrees of forming via temperature profiling. It was developed at Fraunhofer IVV Dresden.
Thermoforming is suitable for large batches of products and is combined here with innovative technologies for temperature control in order to precisely regulate the forming process. Up until now the manufacture of electronic assemblies from structural and functional components has involved production, assembly, and wiring. These are costly steps in terms of time and money. A collaborative project has now developed forming technology whereby a substrate is first processed in its planar state using established technologies for printing and assembly. Only in the last processing step is the 3D geometry generated by forming. Interactive (operating) panels can, for example, be produced at favorable cost. Applications in robotics, home products, medical technology, and the car and aircraft manufacturing industries will benefit from this. The high requirements on ergonomics, design, and functionality in these industries will hence be optimally met. The new process also offers greater design freedom and flexibility.
Customization of forming processes
The Fraunhofer IVV is developing innovative heating and forming technologies to realize novel products. The Fraunhofer IVV Dresden has a specialist team supporting the development of 3D electronic components and offers assistance to companies with aspects such as product design, material selection, and process configuration. A self-developed characterization method enables process limits and relative industrial load limits to be determined. In addition, a thermoforming test rig enables the flexible manufacturing of products on a trial basis. For this work a range of forming processes and technologies are available. Using experimental and numerical simulation, manufacturing processes and product geometries can be simulated and optimized. The thermofoming test rig allows the Fraunhofer IVV Dresden to form a variety of materials with printed electronics for companies.
Contact person at the Fraunhofer IVV Dresden
Fabian Kayatz
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