Fraunhofer Institute for Process Engineering and Packaging IVV
The Recycling Gap in Hybrid Packaging
Hybrid packaging made of cardboard and plastic is increasingly used, especially in hygiene-sensitive sectors and industries operating under strong regulatory pressure (e.g., food). These materials reduce plastic usage by up to 80 % while combining protective performance with structural stability - but they are barely fully recyclable.
The challenge: Bonded material layers cannot be separated well-sorted by today’s recycling infrastructure. Some packaging designs rely on consumers to manually separate the components, but in practice that only happens rarely. The reason for this is limited knowledge about the recycling processes, a low acceptance, unclear on-pack instructions, and uncertainties about proper waste disposal. As a result, hybrid packages typically enter the waste stream as a whole and are lost for material recycling.
»Debonding on Demand« - When Packaging Separates Itself
What if the packaging actively supported its own recycling? This is precisely what the Debonding on Demand (DoD) concept enables. After use, the bond between cardboard and plastic dissolves autonomously and in a controlled manner, allowing both materials to re-enter the recycling stream in pure fractions.
Innovative adhesive formulations ensure that the packaging remains stable during use and transport but separates reliably when a defined trigger is applied. This improves recyclate quality, reduces environmental impact, enables classification as “recyclable,” and lowers cost obligations under §21 VerpackG.
From Circularity Requirements to Tangible Prototypes
Fraunhofer IVV conducts intensive research into demand-driven, resource-efficient packaging solutions and their scalable production and alternative recycling technologies for multi-layer packaging.
In the DEBO-Pack project, the team first analyzed the application fields with the highest potential for hybrid packaging. Existing and new solutions were assessed for their DoD suitability, and initial preferred clusters were defined. Packaging concepts with strong barrier performance and high adaptability to diverse product geometries were investigated. For defining the demonstrator, reference metrics such as seal tightness limits and compression resistance were considered.
Using its extensive expertise in packaging concept development, combined with 3D printing for tool design and the MoTiV thermoforming pilot line, the Fraunhofer IVV produced initial demonstrator packages within short development cycles and evaluated them for optimization potential. Several variants are currently under evaluation to identify the most technically and economically viable solution that is also consumer acceptable.
In parallel, Fraunhofer IFAM is conducting laboratory tests on novel adhesive systems, assessing their behavior and debonding performance under realistic conditions. Based on these findings, a scalable production concept is being developed, including the required adhesive application technology.
If you have questions or would like further information about our research project, feel free to contact us!
Project Information
| Project duration | May 1, 2024 – April 30, 2027 |
Founding |
Fraunhofer-Gesellschaft »Interne Programme«, Programm »Prepare« |
| Project partners |
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