Transfer metallization for paper packaging

© Fraunhofer IVV

Enabling sustainable high-barrier paper packaging

Looking to reduce plastic and aluminum laminates without compromising product protection, material efficiency, or recyclability? For sensitive food products in particular, paper-based packaging solutions often reach their functional limits. Oxygen ingress, water vapor transmission, and aroma loss can significantly affect product quality and shelf life.

With the transfer metallization technology developed at Fraunhofer IVV, you can unlock new opportunities for fiber-based packaging. Ultra-thin inorganic functional layers provide paper with excellent barrier properties, enabling high-performance packaging concepts with a very high fiber content as a resource-efficient alternative to conventional plastic and aluminum laminates.

Take the opportunity to evaluate and test transfer metallization for your packaging development at an early stage. Together, we can lay the foundation for implementing this technology within your organization. For future adoption, we offer opportunities for partnerships and licensing models.

High barrier performance through precision layer transfer

In transfer metallization, the ultra-thin inorganic barrier layer is first applied to a smooth, reusable carrier film. It is then transferred to the paper. This gives the rough paper surface a continuous, uniform high barrier.

In the "IMPACT" project, we are driving the further development of this technology forward with international partners. At the same time, we are working with companies to implement transfer metallization in practical applications.

Applications

  • Packaging for snacks and confectionery
  • Sachets for powdered and instant products
  • Lid and sealing solutions for coffee and food products
  • Packaging for pharmaceutical and healthcare products
  • Packaging for cosmetics and other sensitive contents

Two transfer methods for different requirements

Depending on the material, packaging structure, and production process, two transfer metallization approaches are available. For your specific application, we select and optimize the most suitable transfer route and tailor it to your materials and existing manufacturing processes. This enables the targeted implementation of either metallic-silver or transparent barrier layers for a wide range of packaging concepts.

Adhesive Layer

An adhesive layer bonds the functional layer formed on the carrier film to the paper.

Heat-seal layer

Heat and pressure activate the heat-seal layer integrated into the transfer film and transfer the functional layer onto the paper.