interpack 2026

»Holistic solution development for a packaging industry in transition

Using selected development highlights that showcase our broad range of expertise, we will demonstrate from May 7–13, 2026, at interpack in Düsseldorf, Hall 4, Booth C54, how we support the industry in the development, implementation, and assurance of sustainable, efficient, and future-ready packaging production:

• Solutions for Fiber-Based Packaging

Must-see highlight »Papure«: Paper Joining without any Foreign Materials

Sustainable Packaging Solutions based on Locally Sourced Bog Plants

»DEBO-Pack«: Circular Multimaterial Packaging via Single-Material Component Separation

»TransMet«: Transfer Metallization for the Production of Barrier Coatings on Paper and Bioplastics

• Technologies for the Material Flow of Recyclate Materials

Must-see highlight »HIS«: High-speed impulse welding for the safe and efficient joining of monomaterial films

»MoTiV«: Evaluation of Processability and Optimization of Processing Processes for Packaging Materials with Varying Recycled Content

»TZ-Lack (Thermoformable Lacquer)«: deep-drawable barrier lacquer for food-safe use of recycled materials in thermoformed packaging.

• Digital Solutions and AI

»imageSAM« - Self-learning assistance system for continuous, automated optical quality monitoring

Ask Your Company Chatbot! Digital Knowledge Management System

Efficient personnel training through VR-based learning solutions

• Data-Driven Measurement of Efficiency and Resource Consumption and Predictions of Product Shelf Life

»VERA« Unique data acquisition system for monitoring efficiency, availability, and resource consumption in manufacturing and packaging processes

Digital tools for shelf-life prediction: comparison of the protective performance of alternative food packaging.