Trade Fair interpack 2026 / May 07, 2026 - May 13, 2026
Visit us at the interpack 2026!
Hallo 4, Booth C54
Holistic solution development for a packaging industry in transition
Using selected development highlights that showcase our broad range of expertise, we will demonstrate from May 7–13, 2026, at interpack in Düsseldorf, Hall 4, Booth C54, how we support the industry in the development, implementation, and assurance of sustainable, efficient, and future-ready packaging production.
In addition to innovative technologies for processing recycled and fiber-based materials, we present forward-looking packaging solutions, digital tools for smart and efficient processes and the safeguarding of internal corporate expertise, as well as data-driven methods for measuring efficiency and resource use and predicting product shelf life:
- Solutions for Fiber-Based Packaging
Must-see highlight »Papure«: Paper Joining without any Foreign Materials
Sustainable Packaging Solutions based on Locally Sourced Bog Plants
»DEBO-Pack«: Circular Multimaterial Packaging via Single-Material Component Separation
»TransMet«: Transfer Metallization for the Production of Barrier Coatings on Paper and Bioplastics
- Technologies for the Material Flow of Recyclate Materials
Must-see highlight »HIS«: High-Speed Impulse Welding for the Safe and Efficient Joining of Monomaterial Films
»TZ-Lack (Thermoformable Lacquer)«: deep-drawable barrier lacquer for food-safe use of recycled materials in thermoformed packaging.
- Digital Solutions and AI
Ask your company’s chatbot! AI-Based Internal Kowledge Management
»imageSAM« - Self-Learning Assistance System for Continuous, Automated Optical Quality Monitoring
Efficient Personnel Training through VR-Based Learning Solutions
- Data-Driven Measurement of Efficiency and Resource Consumption and Predictions of Product Shelf Life
Fraunhofer Institute for Process Engineering and Packaging IVV